| List Number: | RKC.030 |
| Manufacturer: | Delta |
| Price excluding VAT: | 53,72 Kč |
The BGA stencil is a service aid designed for working with the chipset of the Samsung Galaxy S3 I9300 phone. It is used when repairing electronic components with a BGA package, especially when restoring solder joints during the reballing process.
The stencil helps accurately position solder balls on the chip contact area and makes it easier to prepare the component before it is mounted back onto the printed circuit board.
Designed for:
Samsung Galaxy S3 I9300
Accessory type:
Matrix / stencil for BGA joints
Use:
Service and electronics repairs, work with BGA chipsets, reballing.
