| List Number: | RK.017 |
| Manufacturer: | Delta |
| Price excluding VAT: | 70,25 Kč |
BGA stencil is a service aid designed for working with the chipset of a Xiaomi Redmi phone. It is used when repairing electronic components with a BGA package, especially when restoring solder joints during the reballing process.
The stencil helps accurately place solder balls on the chip contact area and makes it easier to prepare the component before mounting it back onto the printed circuit board.
Intended for:
Xiaomi Redmi
Accessory type:
Matrix / stencil for BGA joints
Use:
Service and electronics repairs, work with BGA chipsets, reballing.
